臺灣博碩士論文加值系統

本研究選用KCN浸泡處理與使用半加成法(semi additive process，SAP)製作線路之IC載板(IC carrier)進行反應，讓CN- 與基板表面殘留的鈀金屬反應，可大幅改善無電鍍鎳金製程(化鎳浸金或化鎳鈀金)後基材上沉積金之品質問題，同時不影響基板其他表面特性(外觀及粗糙度)，提升IC載板製程中無電鍍鎳金表面處理與線路半加成法之匹配性。研究中利用DOE(design of experiment)方法設定不同KCN濃度及浸泡處理時間，最後找出KCN浸泡處理之最佳參數為濃度20g/L浸泡時間120秒。

In this study, add KCN dipping treatment and make CN- reacts with Pd ion residue on IC substrate copper line build up by SAP method. Finally we find KCN dipping treatment can effectively improve the issue that electroless Ni/Pd/Au layer depositing on core or prepreg. At the same time, check there is no side effects of KCN dipping treatment on substrate surface characteristics include both morphology and roughness. It promotes the collocation between electroless Ni/(Pd)/Au and SAP build up process of IC substrate manufacturing. In this study, we use DOE (design of experiment) experiment method and find KCN dipping treatment(20g/L-120seconds) is the optimum parameter.

摘要.............................................I
Abstract.........................................II
致謝.............................................III
目錄.............................................IV
圖目錄...........................................VII
表目錄...........................................XIV
第一章 緒論.........................................1
1.1 研究背景........................................1
1.2 工業界常見之表面處理種類..........................2
1.3 研究目的........................................3
第二章 文獻回顧 .....................................6
2.1 無電鍍原理.......................................6
2.1.1 氧化還原反應...................................7
2.2 金屬最終表面處理..................................9
2.2.1 噴錫(hot air solder leveling, HASL) ..........9
2.2.2 化學浸鍍錫(immersion tin, I-Sn) ..............10
2.2.3 化學浸鍍銀(immersion silver, I-Ag) ...........11
2.2.4 有機保銲劑(Organic Solerability Preservatives,OSP) ...12
2.2.5 化鎳浸金(electroless nickel/immersion gold, ENIG) ......14
2.3 化鎳浸金(ENIG)所遭遇之問題與挑戰..................16
2.4 化鎳化鈀浸金 ENEPIG.............................17
2.4.1 化鎳化鈀浸金興起之原因.........................17
2.4.2 ENEPIG反應機構...............................21
2.4.2.1 清潔槽反應機構.............................21
2.4.2.2 微蝕槽反應機構.............................21
2.4.2.3 活化槽反應機構.............................22
2.4.2.4 化鎳槽反應機構.............................22
2.4.2.5 化鈀槽反應機構.............................23
2.4.2.6 浸金槽反應機構.............................24
2.4 PCB線路製程...................................25
2.4.1 減成法(Substractive Process)................25
2.4.1.1 全板電鍍法(Panel Plating Process)..........25
2.4.1.2 線路電鍍法(Pattern Plating Process)........25
2.4.2 加成法Additive Process......................26
2.4.2.1 半加成製程.................................26
2.4.2.1 全加成製程.................................27
2.4.3 線路半加成製程對ENIG以及ENEPIG的影響...........28
2.5 PCB基材除鈀方法................................30
第三章 實驗方法與步驟...............................32
3.1 實驗藥品......................................32
3.2 實驗步驟與設備.................................33
3.2.1 KCN浸泡.....................................33
3.2.2 ENEPIG製程.................................35
3.2.3 場發射掃描式電子顯微鏡.......................36
3.2.3.1 實驗裝置.................................36
3.2.3.2 儀器原理.................................37
3.2.3.3 實驗步驟.................................39
3.2.4 白光干涉儀.................................40
3.2.4.1 實驗裝置.................................40
3.2.4.2 儀器原理.................................40
3.2.4.3 實驗步驟.................................44
第四章 實驗結果與討論..............................45
4.1 KCN浸泡處理對ENEPIG後基材上金的改善狀況觀察......45
4.2 ENEPIG鍍層表面形貌觀察.........................56
4.3 探討KCN浸泡處理對銅面/基材/綠漆的影響............65
4.3.1 表面形貌觀察.................................65
4.3.2 粗糙度分析...................................85
第五章 結論........................................91
5.1 實驗結論.......................................91
5.2 未來工作.......................................91
參考文獻............................................92

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