臺灣博碩士論文加值系統

塑膠射出模具的表面狀態影響產品的品質與良率，現今台灣塑膠產品產業相當發達與成熟，面臨低價地區的競爭，企業經營相當辛苦。台南地區為塑膠射出產業極具聚落特性，應用產品主要為汽機車零組件，生產這些產品零組件的專業模居相當昂貴，價格通常80~150萬新台幣。
國際汽機車塑膠射出產業競爭激烈，成本通常是公司產品競爭力的主因，所以提升模具壽命可將製造成本有效降低。本論文研究TiN薄膜運用於SKD61特性，藉以提升膜壽命，為國內產業尋求優良的模具表面處理技術。
二十年來，以物理氣相化學沉積法(Physical Vapor Deposition，PVD)的方式被覆陶瓷硬質薄膜，如氮化物(nitride)、碳化物(carbide)等，於高速鋼切削刀具、磨耗設備以及碳化鎢等底材表面上，抵抗磨耗(wear)、腐蝕(corrosion)及其它不能接受的損害，以及增加切削、成形工具和機械元件的使用壽命已證實非常成功，因其具高硬度及化學穩定性。至今仍在工業應用中使用頻繁，從加工刀具、機械元件到裝飾件等。
本論文選擇SKD61為被覆基材，蒸鍍薄膜為TiN，藉改變基板偏壓、氮氣分壓、靶材電流、試片擺放位置等製程變數，來探討對薄膜性質之影響。
由於本論文中SKD61模具鋼為採用回火溫度為600℃之處理後材料，工具鋼在350~450℃間進行被覆處理，可獲較佳之附著力。本實驗設備是採用電漿轟擊方式加熱，所以在蒸鍍過程中，工件溫度隨製程變數而變化。
本論文主要是探討PVD蒸鍍系統的基本操作參數例如溫度、偏壓、鍍膜功率等對TiN薄膜的優選方向、微結構特性與耐腐蝕性的影響。

Two decades to the way Physical Vapor Deposition hard ceramic thin film coating, such as nitride, carbide, etc.
Applies to high-speed steel cutting tools, wear such equipment, as well as tungsten carbide substrate surface, wear, corrosion and other damage can not accept, as well as increasing cutting and forming tools and mechanical components of the life has been proven very successful,Because of their high hardness and chemical stability.
Is still frequently used in industrial applications, such as cutting tools, machinery and other components to decorative pieces.
In this paper, choose SKD61 substrate for sputtering, thin film deposition for the TiN, the use of change in substrate bias, nitrogen pressure, target current, the location of samples, such as process variables, to explore the effect of the nature of the thin film.
As a result of this paper is the use of die steel SKD61 tempering, temperature of 600 ℃ after handling materials, tool steel at 350 ~ 450 ℃ was between sputter processing, the adhesion will be better.
The experimental device is the use of plasma bombardment heating means, so sputtering process, the workpiece temperature with changes in process variables.
This paper is to explore the main PVD sputtering system''s basic operating parameters such as temperature, voltage, power coating film on the TiN preferred orientation, microstructure characteristics and the impact of corrosion resistance.

中文摘要Ⅰ
英文摘要Ⅲ
誌謝Ⅳ
總目錄Ⅴ
表目錄Ⅷ
圖目錄Ⅸ
第一章 緒論1
1-1 物理蒸鍍投術的歷史治革1
1-2 非平衡磁控濺鍍1
1-3 影響物理蒸鍍薄膜性質因素2
第二章 理論基礎3
2-1 TiN鍍膜之結構3
2-2 鍍膜表面及截面型態結構3
2-3 基板偏壓的效應4
2-4 電漿的產生5
2-5 輝光放電5
2-6 影響濺射率的因素6
第三章 實驗方法與步驟8
3-1 實驗目的8
3-2 實驗流程8
3-3 實驗方法與規劃8
3-3-1 實驗材料8
3-3-2 PVD實驗設備9
3-3-3 實驗前處理9
3-3-4 試片擺放位置10
3-3-5 鍍層成長條件與步驟10
3-4 鍍層性質測定10
3-4-1 鍍層厚度與成長速率測量10
3-4-2 硬度測量10
3-4-3 鍍層表面形態與截面形態觀察11
3-4-4 晶體結構分析11
3-4-5 鍍層粗糙度測量11
3-4-6 腐蝕試驗11
3-4-7 附著性11
第四章 實驗結果與討論12
4-1 製程變數對沈積速率之影響12
4-1-1 靶材電流的影響12
4-1-2 氮氣分壓的影響12
4-1-3 基板偏壓的影響12
4-1-4 蒸鍍時間的影響13
4-2 TiN鍍層晶體結構13
4-3 鍍層表面形態觀察13
4-3-1 鍍層顏色觀察13
4-3-2 鍍層橫截面觀察13
4-4 鍍層表面粗糙度14
4-4-1蒸鍍時間的影響14
4-4-2 靶材電流對粗糙度之影響14
4-4-3 氮氧分壓的影響14
4-4-4 基板偏壓對粗糙度之影響14
4-5 TiN鍍層附著性14
4-5-1 基板偏壓效應15
4-5-2 氮氧分壓效應15
4-5-3 靶材電流效應15
4-6 TiN鍍層硬度15
4-6-1 基板偏壓效應15
4-6-2 氮氣分壓效應16
4-6-3 靶材電流效應16
4-7 TiN鍍層耐蝕性16
第五章 結論18
參考文獻19
作者簡介25
表目錄
表2.1 二次電子與氣體分子之撞擊狀況26
表3.1 實驗室片之成份26
表4.1 改變基板偏壓蒸鍍30分鐘基材溫度26
表4.2 改變靶材電流蒸鍍30分鐘基材溫度27
表4.3 蒸鍍時間與耐蝕性之關係27
圖目錄
圖1.1 封閉式非平衡磁控濺鍍法配置圖28
圖1.2 非平衡磁控濺鍍法的磁力線範圍28
圖1.3 傳統磁控濺鍍法與非平衡磁控濺鍍法的磁力線比較29
圖2.1 TiN晶體結構與MC-carbide晶體結構29
圖2.2 Thornton之SZM模型30
圖2.3(a) Henderson之硬球模型30
圖2.3(b) Dirks之硬球模型31
圖2.4 Messier對SZM之修正模型31
圖2.5 帶有能量之離子轟擊對基材表面及鍍膜成長的影響32
圖2.6 鍍膜系統與輝光放電的關係[16]32
圖2.7 濺射系統的位能圖[16]33
圖2.8 Ar離子在400 V加速電壓下對各種元素的濺射率33
圖2.9 濺射率隨離子入射角度的變化34
圖2.10 濺射率與靶材溫度的關係35
圖3.1 實驗流程圖35
圖3.2 實驗所用之試片尺寸36
圖3.3 封閉式非平衡磁控濺射系統36
圖3.4 粗糙度示意圖37
圖3.5 恆電位儀主要設備之簡圖38
圖3.6 壓痕等級示意圖38
圖4.1 靶材電流大小與沈積速率之關係39
圖4.2 氮氣分壓與沈積速率之關係39
圖4.3 基板偏壓與沈積速率之關係40
圖4.4 蒸鍍時間與沈積速率之關係40
圖4.5 不同靶材電流X-ray繞射分析41
圖4.6 不同氮氣分壓X-ray繞射分析41
圖4.7 不同偏壓X-ray繞射分析42
圖4.8 基板偏壓-50V之TiN組織圖42
圖4.9 基板偏壓-100V之TiN組織圖42
圖4.10 蒸鍍時間與粗糙度之關係43
圖4.11 靶材電流與粗糙度之關係43
圖4.12 氮氣分壓與粗糙度之關係44
圖4.13 基板偏壓與粗糙度之關係44
圖4.14 偏壓效應之壓痕觀察圖45
圖4.15 氮氣分壓效應之壓痕觀察圖45
圖4.16 靶材電流效應之壓痕觀察圖45
圖4.17 不同荷重與硬度之關係46
圖4.18 基板偏壓與硬度之關係46
圖4.19 氮氣分壓與硬度之關係47
圖4.20 靶材電流與硬度之關係47
圖4.21 不同蒸鍍時間之TiN鍍層之極化曲線48
圖4.22 經過鹽霧試驗100小時後表面缺陷48
圖4.23 膜厚0.75μm經過鹽霧試驗後表面缺陷處顯微圖48

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