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研究生:張珉華
研究生(外文):Chang, Min Hua
論文名稱:異質微夾爪之設計與實作
論文名稱(外文):Design and Fabrication of Heterogeneous Micro-Grippers
指導教授:侯帝光
指導教授(外文):Max T. Hou
口試委員:林君明鄧琴書
口試委員(外文):Jium-Ming LinChyn-Shu Deng
口試日期:2014-07-21
學位類別:碩士
校院名稱:國立聯合大學
系所名稱:機械工程學系碩士班
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2014
畢業學年度:102
語文別:中文
論文頁數:84
中文關鍵詞:梳狀靜電致動器異質微夾爪
外文關鍵詞:electrostatic comb drive actuatormicro gripper
相關次數:
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本文提出一種利用矽與高分子材料,製作異質整合微夾爪。此微夾爪包含梳狀靜電致動器、微夾爪結構與高分子基板。本研究藉由高分子基板,將電壓施加於梳狀靜電致動器,因靜電作用使致動器之定子與轉子互相靠近,帶動微夾爪結構閉合。依照上述原理,本研究設計出一個行程約35 m之微夾爪。本研究除了對上述設計,有進行理論分析,也利用COMSOL模擬施加電壓,比較兩者位移情形。此外,本文摻合半導體製造與封裝技術之元件製程(犧牲橋製程),進行元件製造,可成功製作出一全深度的試片。並藉由模擬結果得知,當施加電壓於手指電極時,可帶動夾爪結構坐靠合運動,達到夾取的目的。而手指電極損毀原因,可能為在做背部貫穿製程時,亦或是移除犧牲橋結構的碎削、施加探針時,均可能使其結構損壞,故在後續製程過程中,應加強手指電極的部分,使手指電極保持其結構之完整性,可增加後續的製程的成功率。
This study presents a method to manufacture the heterogeneous micro gripper by using silicon and polymer materials. The micro-gripper contains an electrostatic comb-drive actuator, a gripper and a polymer substrate. When applying a voltage onto the polymer substrate, the power would be transferred through the substrate onto the electrostatic comb drive actuator. Due to the electro static force generated by the fix electrodes and movable electrodes, the electrodes can approach to each other and make gripper grip a small object. According to the above theory, a micro gripper was designed. The largest moving distance between two jaws is about 35 m. The design was theoretical analyzed and simulated using COMSOL. Simulation results confirm that this micro-gripper can move 35 m. The work used the sacrifice bridge process, which integrates the semiconductor manufacturing process and the packaging technology, to fabricate specimen. Based on simulation results, when voltage is applied on the finger electrodes, the jaw structure connecting to the electrodes can grip.
致謝
中文摘要
Abstract
目錄
圖目錄
表目錄
符號表
第一章 前言
1.1 研究背景
1.2 研究動機
1.2.1 微夾爪文獻回顧
1.2.2 微致動器文獻回顧
1.3 研究目標
1.4 論文架構
第二章 原理
2.1平行板電容
2.2梳狀致動器
第三章 元件設計
3.1 元件設計
3.2 製程設計
3.2.1 犧牲橋製程
3.2.2 整體製程
第四章 理論與模擬分析
4.1 理論分析
4.2 Comsol Multiphysics模擬分析
4.2.1 使用Comsol Multiphysics 模擬設計
4.2.2 Comsol Multiphysics模擬步驟
4.2.3 結構模擬結果
4.2.4理論位移與模擬位移討論
第五章 元件製作與實驗
5.1 元件製作步驟與材料介紹
5.1.1 晶圓前處理
5.1.2 光阻塗佈與旋開
5.1.3 軟烤
5.1.4 曝光
5.1.5 顯影
5.1.6 清洗與旋乾
5.1.7 硬烤
5.1.8 蝕刻步驟
5.1.9 去除光阻
5.1.10 元件蝕刻貫穿
5.1.11 去除氧化層
5.2 印刷電路板製作與設計
5.3 元件金屬蒸鍍
第六章 實驗測試與結果
6.1 元件接合實驗
6.1.1 錫球接合
6.1.2 黏膠接合
6.2 釋放犧牲橋實驗
6.2.1 錫球釋放樣品
6.2.2 黏膠釋放樣品
6.3 量測與驅動實驗
6.4 實驗結果
第七章 結論
參考文獻

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