臺灣博碩士論文加值系統

　　本文旨在探討壓克力基板之背式蝕刻與切割技術，以及玻璃基板之背式切割技術。所使用之雷射為Nd:YAG雷射與CO2雷射，實驗材料為壓克力與青板玻璃。壓克力背式蝕刻，雷射係從試片背部加載，雷射穿越至基板正面，進行燒熔氣化；正面切割則係雷射直接於基板正面加載，將材料氣化移除。為克服壓克力與玻璃材料不易吸收Nd:YAG雷射光之缺點，需沿擬加工路徑塗佈黑色塗料，以助於吸收雷射能量。本文探討壓克力之蝕刻品質及切割品質，比較正面加工與背式加工之優劣，討論不同雷射功率、加載次數、切割速度及輔助冷卻效果所能獲得的蝕刻品質及切割品質。其次探討青板玻璃的雷射破裂切割技術，討論不同雷射功率、焦點距離、切割速度、冷卻效果之斷面品質。本文發現背濕式蝕刻可以增加蝕刻之深度，穩定蝕刻寬度及品質；背濕式切割可以減少破裂切割所產生的裂紋、殘渣等缺陷。本文以電子顯微鏡觀察壓克力之蝕刻面、燒熔斷面及青板玻璃之破裂斷面，以暸解其蝕刻、燒熔與破裂等機制。最後以有限元素分析軟體ANSYS，分析雷射蝕刻與燒熔的溫度場，據以解釋壓克力基板之蝕刻與燒熔原理。
關鍵字：壓克力、青板玻璃、雷射蝕刻、雷射切割

The aim of this paper is to study the laser backside etching and cutting techniques for acrylic substrates, and the backside cutting technique for glass substrates. The laser used were the Nd:YAG laser and CO2 laser. The experimental materials were the acrylic substrates and the Soda-Lime glass substrates. The laser applied at the backside of the acrylic substrates propagates through the substrate, and then melts and evaporates the materials in the frontal side. The black coating material was painted along the desired machining path to enhance the absorptive of the Nd:YAG laser to the acrylic and glass substrates. The etching quality and the cutting quality of the acrylic substrates for the parameters of laser power, laser applied times, etching speed, cutting speed, and the cooling method were investigated. The breaking surface quality of the Soda-Lime glass for the parameters of laser power, cutting speed, and cooling effect was also studied. It can be found that the backside wet etching can enhance the etching depth and etching width, and improve the geometric quality. The backside wet cutting can reduce the micro-cracks and debris in the breaking surface of the Soda-Lime glass. Finally, the SEM photographs of the etching surfaces and the cutting surface were obtained to analyze the mechanism of the etching, cutting, and breaking. The finite element software ANSYS was employed to calculate the temperature distributions for the cases of laser etching and cutting.
Keywords: Acrylic, Soda-Lime glass, Laser etching, Laser cutting.

摘要 .........................................................I
Abstraact....................................................II
目錄 .......................................................III
表錄 .......................................................VII
圖錄 ......................................................VIII
第一章 緒論 ................................................1
1.1研究動機 .............................................1
1.2傳統壓克力切割技術 ...................................1
1.3壓克力之雷射切割與蝕刻技術 ...........................2
1.4雷射控制破裂切割的技術原理 ...........................4
1.5本文目的 .............................................4
第二章 雷射蝕刻與切割技術之設備系統 .........................7
2.1雷射系統 .............................................7
2.2冷卻系統 .............................................8
2.3觀察與量測設備 .......................................8
第三章 雷射蝕刻與切割原理 ...................................14
3.1試片材料及塗料 ......................................14
3.2雷射基本模式 ........................................15
3.3 Nd:YAG雷射蝕刻原理雷射 ..............................16
3.4液體輔助雷射蝕刻原理 ................................16
3.5液體輔助雷射內雕原理 ................................16
3.6全燒熔式雷射切割原理 ................................17
3.7半燒熔式雷射切割 ....................................17
3.8背式控制破裂雷射切割原理 ............................18
3.9水輔助控制破裂雷射切割原理 ..........................18
第四章 壓克力基板之雷射蝕刻與切割實驗 ......................24
4.1 Nd:YAG雷射蝕刻-背乾式 ...............................24
4.1.1流程蝕刻 .......................................24
4.1.2蝕刻參數 .......................................25
4.1.3蝕刻品質 .......................................26
4.2 Nd:YAG雷射蝕刻-背濕式 ...............................27
4.2.1實驗流程 .......................................27
4.2.2蝕刻參數 .......................................27
4.2.3蝕刻品質 .......................................28
4.3液體輔助雷射內雕 ....................................29
4.4全燒熔式雷射切割 ....................................29
4.4.1切割流程 .......................................29
4.4.2切割參數 .......................................30
4.4.3切割品質 .......................................30
4.5半燒熔式破裂切割 .....................................31
4.5.1切割流程 .......................................31
4.5.2切割參數 .......................................31
4.5.3切割品質 .......................................32
4.6雷射控制破裂 .........................................32
第5章 青板玻璃之雷射背式切割實驗 ..........................52
5.1控制破裂實驗流程 .....................................52
5.2背式控制破裂雷射切割-直線切割 ........................53
5.2.1乾式切割 .......................................53
5.2.2水輔助控制破裂雷射切割 .........................55
5.3背式控制破裂雷射切割-曲線切割 ........................56
5.3.1乾式切割 .......................................56
5.3.2水輔助控制破裂雷射切割 .........................57
5.4路徑偏移 .............................................57
第六章 壓克力之雷射蝕刻與切斷之有限元素分析 ................76
6.1基本假設 .............................................76
6.2壓克力切斷之溫度分析 .................................77
6.3壓克力蝕刻之溫度分析 .................................77
第七章 結論 ................................................85
7.1本文重要成果 .........................................83
7.2未來研究方向 .........................................84
參考文獻 ....................................................85
簡歷.........................................................87

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