臺灣博碩士論文加值系統

隨著積體電路線寬的縮小半導體製程良率備受挑戰，而無污染製造成了半導體製程中最關鍵的因子，尤其是積體電路製造。污染物控制的概念不僅涉及空氣中懸浮粒子的濃度控制，還涉及氣態分子污染的監控。懸浮粒子濃度的控制通常透過不同過濾效率的濾網捕捉，而這些濾網也是組成潔淨室的主要設備。另一方面，氣態分子污染物（Airborne Molecular Contamination，AMC）必須通過遮蔽或迫淨（Purge）的方法移除，這與設備前端模組（Equipment Front-End Module，EFEM）及晶圓盒（Front Opening Unified Pod，FOUP）內部的氣流形式有關，於多數半導體製程中，常因為設備前端模組內不同的擺設造成設備前端模組內的氣流偏斜，入侵晶圓盒造成污染。以蝕刻製程為例，晶圓於微環境（Mini-Environment）等待轉入蝕刻和濕洗製程腔體過程中，會因為晶圓盒門扉開啟，使先前製程所殘留的氟化氫與空氣中的水氣及氧氣逐漸產生成高濃度的氟離子，進而成為銅與氧反應的催化劑，導致雙鑲嵌圖案銅損失，嚴重影響晶圓的良率，所以晶圓盒門扉開啟時的污染控制至關重要。
本研究比較常規的迫淨方式（Conventional Purge）及導流管迫淨方法（Diffuser Purge）搭配層流氣簾裝置（Laminar Air Curtain），於晶圓盒開門時設備前端模組內不同配置，氣流入侵晶圓盒的情形。其中迫淨及提供層流氣簾的方法是從晶圓盒的後方和外部輸送壓縮乾空氣（Compress Dry Air），分別產生由內而外和乾燥的屏障，阻隔設備前端模組內偏斜的氣流入侵晶圓盒。實驗中以霧化的乙二醇作為示蹤氣體（Tracer gas），並利用高速攝影機紀錄煙霧被綠光雷射照射後所散射出的光源來建立流場可視化技術，達到監測及分析之目的。為了證明及量化流場可視化實驗，本實驗也同時進行了晶圓盒內相對濕度的紀錄。
實驗結果表明，導流管迫淨和層流氣簾的搭配在不同設備前端模組的配置下皆展現了絕佳的效果，阻隔外部氣流入侵晶圓盒，且可將此裝置實際應用於半導體製造過程中。

As the gate length of integrated circuits shrinks, the yield of semiconductor processes is challenged, and contamination-free manufacturing has become the most critical factor in semiconductor high-tech processes, especially integrated circuit manufacturing. The concept of contaminant control involves not only particle concentration control but also monitoring of Airborne Molecular Contamination (AMC). The control of particle concentration is usually captured by filters of different filtration efficiencies, which are also the main devices that make up the cleanroom. On the other hand, AMC may be removed by masking or purging method, the removal efficiency is related to the airflow pattern inside the Equipment Front-End Module (EFEM) and the Front Opening Unified Pod (FOUP). In most semiconductor process applications, the airflow is often deflected due to the different arrangement in the EFEM, which invades the FOUP and causes pollution. Taking the etching process as an example, in the process of waiting for the wafer to be etched and wet-washed in the mini-environment, the FOUP door will be released, so that the residual hydrogen fluoride and the moisture in the air are Oxygen produces a high concentration of fluorine, which in turn acts as a catalyst for the reaction of copper with oxygen, resulting in loss of double damascene pattern copper, which seriously affects the process yield of the wafer. Therefore, contamination control when the FOUP door is released during the process is critical. This study compares Conventional Purge and Diffuser Purge with Laminar Air Curtain's shielding method. The method of purging and providing Laminar Air Curtain is to supply Compress Dry Air from the rear and outside of the FOUP, creating a barrier from the inside out and drying, respectively, to block the invaded airflow into the FOUP.
In this experiment, atomized ethylene glycol was used as the tracer gas, and the movement of the smoke was recorded by a high-speed camera to establish a flow field visualization technique. In order to prove and quantify the flow field visualization experiment, this experiment also recorded the relative humidity data of the FOUP.
The experimental results show that the combination of the diffuser and the laminar air curtain exhibits excellent effects in blocking the external airflow in the different arrangement of the EFEM, and the both of those two devices can be practically applied in the semiconductor manufacturing process.

目錄

摘要 i
ABSTRACT iii
誌謝 v
第一章 緒論 1
1.1 研究背景及動機 1
1.2 潔淨室 3
1.2.1 潔淨室的定義 3
1.2.2 潔淨度之分級規範 3
1.2.3 潔淨室的種類 5
1.3 設備前端模組 9
1.3.1 微環境 10
1.3.2 前開式晶圓傳送盒 10
1.3.3 晶圓卸載模組 12
1.3.4 矽晶圓 13
1.4 氣態分子污染物 13
1.5 文獻回顧 15
1.6 研究目的 17
第二章 實驗設備及儀器 18
2.1 實驗設備 18
2.1.1 潔淨空調實驗室 18
2.1.2 設備前端模組 19
2.1.3 實驗用晶圓傳送盒 19
2.1.4 層流氣簾裝置 21
2.1.5 壓縮乾空氣系統 23
2.1.6 示蹤氣體 24
2.1.7 雷射成像掃掠系統 25
2.1.8 影像紀錄設備 27
2.2 實驗儀器 28
2.2.1 熱線式風速計 28
2.2.2 浮子式流量計 28
2.2.3 溫濕度計 29
2.2.4 轉速計 29
2.2.5 數位壓力計 30
2.2.6 實驗用晶圓 30
2.2.7 微型多功能無線溫濕度感測器 31
第三章 實驗方法 32
3.1 實驗系統圖 32
3.2 研究案例 36
3.3 實驗流程圖 39
3.4 理論分析 40
3.5 質點影像測速技術 41
3.6 相對濕度紀錄 42
3.7 實驗數據分析方法 43
第四章 結果與討論 45
4.1 流場可視化實驗結果 45
4.1.1 基礎佈局 45
4.1.2 佈局一 52
4.1.3 佈局二 58
4.1.4 佈局三 64
4.1.5 直交表與因子反應表 70
第五章 結論 72
參考文獻 73
符號彙編 77

[1]S. C. Hu, A. Shiue and Y. T. Yang "450mm FOUP/LPU system in advanced semiconductor manufacturing processes: A study on the minimization of oxygen content inside FOUP when the door is opened, " 2015 Joint e-Manufacturing and Design Collaboration Symposium (eMDC) & 2015 International Symposium on Semiconductor Manufacturing (ISSM), Taipei, Taiwan, 2015.
[2]J. Barker, S. Miner, W. Zhao, J. S. Kim, J. Moore, E. Ramanathan ,S. Case, and S. Waite, "Defectivity and Yield Impact From the AMC Inside the FOUP in Advanced Technologies, " IEEE Transactions on Semiconductor Manufacturing, vol. 30, no. 4, 2017, pp. 434-439.
[3]H. Kikyuama, N. Miki, K. Saka, J. Takano, I. Kawanabe, M. Miyashita, and T. Ohmi, "Principles of Wet Chemical Processing in ULSI Microfabrication, " IEEE Transactions on Semiconductor Manufacturing, vol. 4, no. 1, 1991, pp. 26-35.
[4]W. Den, H. Bai and Y. Kan, "Organic Airborne Molecular Contamination in Semiconductor Fabrication Clean Rooms, " Journal of The Electrochemical Society, vol. 153, issue 2, 2006, G149-G159.
[5]I. K. Lin, H. Bai, and B. J Wu, "Analysis of Relationship between Inorganic Gases and Fine Particles in Cleanroom Environment, " Aerosol and Air Quality Research, 2010, pp. 245–254.
[6]M. Lee, and S. J. Yook "Investigation of particulate contamination of heated wafers contained in a closed environment, " Journal of Aerosol Science, vol. 88, 2015, pp. 148-158.
 
[7]H. Tsao, T. Luoh, L. W. Yang, T. Yang, K. C. Chen, and C. Y. Lu "FOUP Environment Control and Condense Reduction, " 2012 Joint e-Manufacturing and Design Collaboration Symposium (eMDC) & 2012 International Symposium on Semiconductor Manufacturing (ISSM), Hsinchu, Taiwan, 2012.
[8]S. C. Hu, T. M. Wu, and H. C. Lin, and K. Hsu "Design and evaluation of a nitrogen purge system for the front opening unified pod (FOUP), " Applied Thermal Engineering, vol. 27, 2007 pp. 1386–1393.
[9]黃哲宇，18吋晶圓傳送盒迫淨方式比較，碩士論文，國立臺北科技大學能源與冷凍空調工程系碩士班，臺北，2014。
[10]阮彥閔，利用流場可視化技術量測300mm晶圓盒載卸模組(FOUP/LPU)開門時FOUP內部流場行為之研究，碩士論文，國立臺北科技大學能源與冷凍空調工程系碩士班，臺北，2014。
[11]李哲瑋，晶圓傳送盒開門情況下內部相對濕度控制方法及其效益比較，碩士論文，國立臺北科技大學能源與冷凍空調工程系碩士班，臺北，2017。
[12]W. Kang, and H. J. Sung "Large-scale structures of turbulent flows over an open cavity, " Journal of Fluids and Structures, vol. 25, Issue 8, 2009.
[13]S. C. Hu, T. Lin, B. R. Fu, and T. Y. Wang "Air curtain application in a purged unified pod, " Applied Thermal Engineering, vol. 111 2017 pp. 1179–1183.
[14]李學涵、唐藝翰、王添毅、彭建元、林廸、胡石政，「晶圓傳遞盒開啟時濕度控制的新方案簡介」，潔淨科技，第四十三期，2019，第36-43頁。
[15]胡大衛，利用計算流體力學於不同微環境流場型式下對晶圓盒內部濕度分布之研究，碩士論文，國立臺北科技大學能源與冷凍空調工程系，臺北，2019。
 
[16]胡士嘉，利用光的散射原理開發氣膠可視化系統用於無塵室內監測及控制微粒污染，碩士論文，國立臺北科技大學機械與自動化碩士外國學生專班，臺北，2018。
[17]https://zh.wikipedia.org/wiki/%E7%B1%B3%E6%B0%8F%E6%95%A3%E5%B0%84
[18]https://www.rdmag.com/article/2018/01/how-classification-impacts-design-cleanroom
[19]https://asia.nikkei.com/Editor-s-Picks/Interview/Silicon-wafer-maker-cautious-despite-strong-chip-demand
[20]https://www.ionicon.com/information/documentation/amc-airborne-molecular-contamination
[21]ORCA-Flash4.0 V3 Digital CMOS camera C13440-20CU Technical Note
[22]https://upload.wikimedia.org/wikipedia/commons/d/de/PIVlab_multipass.jpg