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研究生:徐台生
研究生(外文):Tai-Sheng Xu
論文名稱:先進抗彈陶瓷片材料超音波加工分析
論文名稱(外文):Ultrasonic Machining of Armor Ceramic Tiles Materials Inspection Technological
指導教授:蘇艾蘇艾引用關係
指導教授(外文):Ay Su
學位類別:碩士
校院名稱:元智大學
系所名稱:機械工程學系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2010
畢業學年度:99
語文別:中文
論文頁數:120
中文關鍵詞:超音波加工法抗彈陶瓷片移除率
外文關鍵詞:Ultrasonic machining (USM),Armor ceramic tiles (ACT),Material removal rate(MRR)
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美國海軍陸戰隊LAV裝甲車車身上都會覆蓋上一層抗彈陶瓷片材料,只要安裝上抗彈陶瓷片材料後就可防備重砲的轟擊。以超音波來加工抗彈陶瓷片材料是製造上的ㄧ種方法。而加工時所產生的刀口邊緣之碎屑,在超音波加工陶瓷材料時都可觀察得到,這不只會干擾幾何形狀的準確性,連帶的也會造成加工成本的增加。因此要以具有可靠性與有效率的機器對先進陶瓷片加工就變得更為重要了。而其主要原因還是在於超音波加工可以廣泛的應用在量產與關鍵性的工程上,且超音波加工的製造潛力現已被公認為可靠且有效率的機器加工製造的方法,尤其是運用在先進的陶瓷材料與商業機械加工的過程當中。但唯一的商業化上的限制是;只對圓形孔加工是最有效率的。本研究中是以五個變數及兩階的部份因子作為實驗之設計,其主要目的就在於顯現出加工參數間相互作用的主要效應,例如移除率(MRR),真圓度、圓柱度和表面粗糙度。並使用多晶矽鑽石刀具來比較並探討超音波加工及旋轉式超音波加工這兩種加工方式。

The Marine Corps LAV is being covered with ceramic tiles to protect it against heavy artillery. Ultrasonic machining(USM) is one of the machining processes for armor ceramic tiles materials. Edge chipping, commonly observed in USM of ceramic materials, not only compromises geometric accuracy but also possibly causes an increase in machining cost. Reliable and cost-effective machining of ceramic tiles is crucially important for them to be widely used in a number of critical engineering applications. The potential of Ultrasonic Machining (USM) process has been recognized as one of the reliable and cost-effective machining methods for advanced ceramics and commercial machinery is available for the process. One limitation of the commercial USM machines is that only circular holes can be efficiently machined. In this investigation, a five-variable two-level fractional factorial design is used to conduct the experiments. The purpose of these experiments is to reveal the main effects as well as the interaction effects of the process parameters on the process outputs such as Material Removal Rate (MRR), circularity, cylindricity and surface roughness, which was drawn by comparing ultrasonic machining with rotary ultrasonic machining by polycrystalline diamond(PCD)tool.

書名頁…………………………………………………… I
論文口試委員審定書…………………………………… II
授權書…………………………………………………… III
審定書…………………………………………………… IV
中文提要………………………………………………… V
英文提要………………………………………………… VI
誌謝……………………………………………………… VII
目錄……………………………………………………… VIII
表目錄…………………………………………………… X
圖目錄…………………………………………………… XIV
符號說明………………………………………………… XVI
第一章 緒論……………………………………………………… 1
1-1 研究動機………………………………………………… 1
1-2 研究之背景及目的……………………………………… 1
第二章 研究方法、步驟…………………………………… 5
2-1 直交表之選擇及品質特性之量測………………………… 8
2-2 孔精度定義及檢測方法…………………………………… 10
2-3 表面粗糙度影響分析……………………………………… 12
2-4 材料移除率(MRR)之比較……………………………… 12
2-5 切削條件與表面粗糙度的影響…………………………… 13
2-6 可能遭遇之困難及解決途徑…………………………… 13
2-7 研究分別採用田口之方法與原因……………………… 14
2-8 超音波鑽孔原理………………………………………… 14
第三章 田口實驗與實驗數據計算……………………………… 18
3-1 田口實驗計劃法………………………………………… 18
3-2 參數的種類……………………………………………… 18
3-3 參數設計的配置………………………………………… 19
3-4 信號雜音比……………………………………………… 20
3-5 變異數分析……………………………………………… 22
第四章 結果與討論……………………………………………… 25
4-1 零度實驗參數與計算…………………………………… 27
4-2 零度平面加工鑽削參數與孔(中段)粗糙度最佳化分析 33
4-3 零度平面加工鑽削參數與孔(出口)粗糙度最佳化分析 40
4-4 零度平面鑽削參數與孔移除率最佳化分析………… 49
4-5 30度實驗參數與計算…………………………………… 58
4-6 30度鑽削參數與孔移除率最佳化分析………………… 64
4-7 45度實驗參數與計算…………………………………… 70
4-8 45 度鑽削參數與孔移除率最佳化分析………………… 77
第五章 參數驗證結果…………………………………………… 85
5-1 迴轉式超音波加工機之鑽削參數下出口切屑
型態分析觀察……………………………………………. 85
5-2 切削條件對孔偏差之影響分析………………………… 86
第六章 結論與建議……………………………………………… 94
參考文獻……………………………………………………………… 97


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