臺灣博碩士論文加值系統

半導體的製程複雜，又具有再回流（Re-entrant）與重加工的特性，產品需回流到部份同類型之機台數十次之多，且多達四百至六百道的步驟，因此造成生產管理上更加其困難。如何以較簡化的方式，從數百個步驟的製程中，藉由監控系統的應用，清楚明白的顯示目標與實際生產狀況，並即時進行管制與監控，以利達成產出目標，是當前晶圓代工業非常重要的生產管理課題。
本研究基於半導體製程高複雜性與客戶導向的生產型態，發展一目標導向與以關鍵機台為管制要素之生產監控系統。此監控系統採區段管理之方式，設置適當的管制點，可以完全掌握製程前、中、後段，甚至是關鍵機台的生產狀況；另外，經由目標達成的資訊，建構管制點派工法則以使目標得以達成。經由本研究的監控系統架構，可以提供管理者簡化且有效的生產目標與進度的資訊；於生產目標方面，可提升交期達成率與減少生產週期時間與變異，並避免月底症候群發生。

The processes of wafer fabrication are complicated and have characters of re-entrant and rework. The lots will entry the same machine groups around 10 ~ 30 times and contains 400 ~ 600 steps. It’s process characters cause difficulties in production management. Hence, how to use a monitoring and control system to simplify controlling production progress are the key improvement concerns for major production management.
In this research, a Production Monitoring and Control System by Managing the Key Machines was proposed to improve the above production problem. This system is based on section management and sectors setting up. By these sectors definitions, supervisors could catch all information of production progress instantaneously. By the messages of target achieving sector dispatching rule is developed to enhance target acievement. The results showed that this Production Monitoring and Control System could clearly provide the information of production and improve due-date fulfillment. It also improved line balance and avoided The End-of the Month Syndrome.

中文摘要……………………….………………………………………i
英文摘要……………………….………………………………………ii
誌謝……………………….………………………………………iii
章節目錄……………………….………………………………………iv
表目錄………………….……………………………………………viii
圖目錄………………………………………………..……….……….x
第一章 緒論……………………………………………………………1
1.1 研究背景與動機……………………………………………….1
1.2 研究目標………………………………………………………2
1.3 研究方法與步驟……………………………………………….2
第二章 文獻探討……………………………………………………..6
2.1 MES 製造執行系統…………………………………………6
2.2 WIP Control、投料與派工法則………..……………………….8
2.3 模擬與監控系統之應用……………………..……………….20
2.4 生產管制指標………………………….….………………….23
第三章 問題描述……………………………………….……………27
3.1 研究與系統應用的對象簡介……………..………………….27
3.2晶圓製程簡介………………………………………………….28
3.2.1光學顯影……………………………………………..28
3.2.2乾式蝕刻技術…………………………………………29
3.2.3化學氣相沉積技術………………….………………29
3.2.4物理氣相沉積技術………………….…………………30
3.2.5解離金屬電漿（IMP）物理氣相沉積技術…………….30
3.2.6高溫製程……………...…..…….………...…………30
3.2.7離子植入技術……………….………...……………….31
3.2.8化學機械研磨技術…………………..…………………31
3.2.9製程監控………………………….…….……………..32
3.2.10光罩檢測……………………….…….…….…………32
3.3問題定義與分析……………………………………………….33
3.3.1晶圓製造於生產管理上之特性………..………………33
3.3.2問題分析………….……………....…..……………35
第四章 模式構建………………..…….……………………………38
4.1研究構想…………………..……..……..……….…………….38
4.2整體系統架構…………..…………….……….….……………41
4.3管制點設置模式之構建..……………………..….……………43
4.3.1管制點階層分析…………………..………………..43
4.3.2管制點組成要素分析………………..…………………45
4.3.3關鍵機台的定義與分析……………………..…………47
4.3.4管制點訂定的步驟與方法…………..…………………49
4.4管制點目標訂定模式之構建……….………...…….…………54
4.4.1管制點目標訂定之系統架構………………..…………54
4.4.2輸入資料………………..………………………………56
4.4.3輸出資料………………..………………..……………57
4.5管制點派工模式之構建……………..……..…..……..…….…59
4.5.1管制點派工模式的整體架構………………..…………59
4.5.2管制點派工產品選取之方法………………..…………61
4.5.3管制點派工模式……………………..…..…………62
4.6製造執行系統之架構………………..……..…..……..…….…65
第五章 實例導入與分析.…………………….…………..……………69
5.1系統環境基本描述………………….…..…....………………69
5.1.1生產環境資料……………………………..…………69
5.1.2管制點設置.……………………………..…………70
5.1.3管制點目標訂定……………………………..…………72
5.1.4系統使用介面……………..………………..…………80
5.2生產上的問題分析…..…………………………………...……83
5.3系統導入之成效分析…………………..…..…………………92
5.3.1系統的實際成效驗證……………………...…………92
5.3.2監控系統於生產監控上的實用性……………..………96
第七章 結論與未來研究方向………………….…..………………..98
7.1結論……………………………………..…...…………………98
7.2未來研究方向…………………..……..……………………….99
參考文獻……………………………………………………………..100

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