|
[1]A 70V UMOS Technology with Trenched LOCOS Process to Reduce Cgs Hao Wang, Olivier Trescases, H. P. Edward Xu, Wai Tung Ng,Kenji Fukumoto, Akira Ishikawa, Yuichi Furukawa, Hisaya Imai, Takashi Naito, Nobuyuki Sato, Kimio Sakai, Satoru,Tamura, Kaoru Takasuka. [2]A Study of Interstitial Effect on UMOS Performance 1 Hema E. P., Gene Sheu, Aryadeep M., and S. M. Yang [3]High-Performance Split-Gate Enhanced UMOSFET With p-Pillar Structure Ying Wang, Hai-fan Hu, Cheng-hao Yu, and Hao Lan. [4]Investigation of SiC trench MOSFET with floating islands Song Qingwen, Tang Xiaoyan , Zhang Yimeng1, Zhang Yuming1, Zhang Yimen [5]Resurf Stepped Oxide (RSO) MOSFET for 85V having a recordlow specific on-resistance G.E.J. Koops, E.A. Hijzen, R.J.E. Hueting, M.A.A. in 't Zandt Philips Research Leuven, Kapeldreef 75, B-3001, Leuven, Belgium [6]Field Balanced’ SG-RSO structure showing tremendous potential for low voltage Trench MOSFETs C.F. Tong, P.A. Mawby, J.A. Covington University of Warwick [7]B. J. Baliga, 'Power Semiconductor Devices', PWSPublishing Company, Boston, 1996. [8]S. Mahalingam and B.J. Baliga, "A low forward voltagedrop high voltage trench MOS barrier Schottky rectifier withlinearly graded doping profile", ISPSD Abstract, 1998. [9]J. Evans and G. Amaratunga, “The behavior of Very HighCurrent Density Power MOSFET’s”, IEEE Trans. Electron Devices,(44)7, pp. 1148-1153, 1997. [10]Raghvendra Sahai Saxena and Mamidala Jagadesh Kumar, “Trench Gate Power MOSFET: Recent Advances and Innovations. [11]B. E. Taylor, “Power MOSFET Design.” New York: John Wiley, 1993. [12]Penzin, A. Haggag, W. McMahon, E. Lyumkis, K. Hess, "MOSFET Degradation Kinetics and its Simulation," IEEE Transactions on Electron Devices, vol.50, pp. 1445 - 1450, June 2003. [13]F.G. Kassakian, D.J.Perreault, The future of electronicsin automobiles, proceedings ISPSD 2001, June 2001,Osaka, pp. 15-19. [14]E. S. Ammar and T. J. Rogers, "UMOS Transistors on(110) Silicon," IEEE Trans. on Electron Devices, vol.ED-27, no. 5, pp. 907-914, 1980. [15]H. Takaya, K. Miyaki, and A. Kurayanagi, et. al.,"Floating Island and Thick Bottom Oxide Trench GateMOSFET (FITMOS) - A 60V Ultralow On-resistanceNovel MOSFET with Superior InternalBody Diode",Proc. ISPSD, pp.1-5, 2005. [16]S. S. Kim, J. K. Oh and M. K. Han, "A New TrenchedSource Power MOSFET Improving Avalanche Energy"Jpn. J. Appl. Phys., Vol. 42, pp. 2156-2158, 2003. [17]J.P. Phipps and K. Gauen, "New Insights Affect PowerMOSFET Ruggedness", Conference Proceeding ofApplied Power Electronics Conference and Exposition,pp. 290-298, Feb, 1988. [18]Hao Wang “ Power MOSFETs with Enhanced ElectricalCharactersitcs”, 200 Department of Materials Science andEngineering, University of Toronto. [19]Ying Wang, Hai-Fan Hu, Wen-li Jiao, Chao Cheng, “Gate EnhancedPower UMOSFET With Ultralow On-Resistance”, Electron DeviceLetters, IEEE (Volume:31 , Issue: 4 )2010 , Page(s): 338 - 340. [20]Martin-Bragado, P. Castrillo, M. Jaraiz, R. Pinacho,J.E. Rubio, J.Barbolla, V. Moroz, “Fermi-level effects in semiconductor processing:A modeling scheme for atomistic kinetic Monte Carlo simulators”,Journal of Applied Physics, 2005 [21]R.J. Needs, “Quantum Monte Carlo study of silicon self-interstitials”,IWCE Glasgow 2000. [22]Min Yu, Ru Huang, Xing Zhang, Yangyuan Wang and Hideki Oka,“Atomistic Simulation of RTA Annealing for Shallow JunctionFormation Characterizing both BED and TED”, IEICE Trans Electon. E86-C(3): (2003) P.295-300. [23]C.D. Maldonado, R.A. Williams, “A Transient Analytical Model forPredicting the Redistribution of injected interstitials”, Computer-AidedDesign of Integrated Circuits and Systems . [24]Xiao Zhang, Min Yu, Kai Zhan, Liming Ren, Ru Huang, XingZhang, Yangyuan Wang, “ Physical Model for Surface Annihilation ofSilicon Interstitial during annealing. [25]Suliman, O.O. Awadelkarim, S.J. Fonash, G.M.Dolny, J. Hao, R.S.Ridleya and C.M. Knoedler, “The effect of channel boron-doping on the performance and hot electron reliability of N-channel trench UMOSFETs.” Solid-State Electronics 45 (2001) 655-661. [26]Wang Ying, Hu Haifan, Wang Liguo, Yu Chenghao, “Split gate resurfstepped oxide UMOSFET with P-pillar for improved performance”.IET Power Electronics, 2013. [27]Sentaurus Device User Guide, Version K-2015.06, Synopsys Inc.,Mountain View, CA USA, 2015. [28]Mitsubishi High Power Semiconductors,Semiconductor Device Reliability,Aug 1998 [29]T.syau,p.venkatraman,and B.J. Baliga,comparison of ultra low specific on resistance UMOSFET structure:the ACCUFET ,EXTFET,INVFET and Conventional UMOSFETS IEEE Trans.Electron Devices,vol.ED-41,PP.800-808,1994 [30]Reassessment of the intrinsic carrier density in crystalline silicon in view of band-gap narrowing. Altermatt PP, Schenk A, Geelhaar F, Heiser G. Journal of Applied Physics. 2003. [31]Improved value for the silicon intrinsic carrier concentration from 275 to 375 K. Sproul AB, Green MA. Journal of Applied Physics 1991 . [32]Accurate measurements of the silicon intrinsic carrier density from 78 to 340 K Misiakos K, Tsamakis D. . Journal of Applied Physics. 1993. [33]Ralph E. Locher, Abhijit D. Pathak, Senior Application Engineering, IXYS Corporation, “Use of BiMOSFETs in modern Radar Transmitters” IEEE PEDS 2001-Indonesia [34]B. J. Baliga, Enhancement and Depletion Mode Vertical-channel MOS Gated Thyristors, IEEE Electron Letters, London, vol. 15, no.20, pp.645-647, 1979. [35]J. Tihanyi, Functional Integration of Power MOS and Bipolar Devices, International Electron Devices Meeting, pp.75-78, 1980.. [36]J. P. Russel et al, The COMFET, a New Conductance MOS-gate Device, IEEE Electron Device Letters, vol. EDL-4, no.3, pp.63-65,1983. [37]B. J. Baliga et al, The Insulated Gate Transistor (IGT):A New Three Terminal MOS-controlled Bipolar Power Device, IEEE Electron Devices, vol ED-31, no.6, pp.821-828, 1984. [38]Elizabeth Kho Ching Tee et al., Overview of IGBT, In 4th Engineering Conference(ENCON) 2011, Malaysia, November. 2011, to be published. [39]G. Majumdar et al., A New Generation High Speed Low Loss IGBT Module, in Proc.4th International Symposium on Power Semiconductor Devices & IC’S, pp.168-171, 1992. [40]Otsuki M, et al., The 3rd Generation IGBT Toward A Limitation of IGBT Performance, in Proc.5th International Symposium on Power Semiconductor Devices & IC’S, pp.24-29, 1993. [41]S.Dewar et al., Soft Punch Through (SPT) – Setting new Standards in 1200V IGBT, in Proc. Power Electronics/Intelligent Motion/Renewable Energy/Energy Management, Nuremberg, Germany, pp.593-600, 2000 [42]D. A. Grant and J. Gowon, Power MOSFET Theory and Applications, New York: John Wiley, Interscience, 1989. [43]Taurus TSUPREM-4,Version F-2011.09, September 2011 [44]Taurus Medici,Version G-2012.06, June 2012 [45]Sentaurus™ Process User Guide,Version L-2016.03, March 2016 [46]Sentaurus™ Device User Guide,Version L-2016.03, March 2016
|