臺灣博碩士論文加值系統

台灣半導體產業而言，廠商需要能提供給客戶需求更高之機動能力，能夠更實質且為有效產能達成之承諾及表現。因此希望能夠尋求一個可行的方法來解決生產與存貨控制問題，解決諸如供應鏈之間的程序為了因應終端產品的短生命週期及快速顧客回應。本研究的目的就是在半導體供應鏈生產與存貨控制問題中，藉由模式預測控制（Model predictive control；MPC）的方法，應用在半導體供應鏈生產系統上多變數動態製造程序系統和有限條件下的供應鏈控制。在此，我們使用狀態空間法來描述存貨的動態半導體供應鏈程序，此方法的優點在於能清楚表達其為多變數程序中的一個相當直接方法，並以供應鏈的角度，探討程序流程的問題，將生產存貨控制問題分解為個別問題來加以探討。設計一半導體供應鏈生產與存貨控制系統，把物流與資訊流加以整合，且透過所設計之MPC控制系統來實現生產與存貨之最適化控制。

As for the semiconductor industry in Taiwan, the manufacturers need to improve their flexibility in order to satisfy the commitments of the production capability for the customers’ demands. Therefore, we hope to get a suitable method to solve the problem involving the production and inventory control of the supply chain. The objective of this research is to production and inventory with the question of controlling in the semiconductor supply chain, with the method of model predictive control (MPC); multi-variable dynamic manufacture process system and the supply chain under the limited condition is controlled to the semiconductor supply chain production system. Here, we used the state-space method to describe the inventory supply chain process, the advantage of this method lies in to be clear to express the multi-variable process, and discuss the process procedure from the viewpoint of supply chain production. The MPC, combining with material flow and information flow, realize the optimization with the production and inventory to control. It can offer more effective production and inventory controlling and tactics through the application of the control parameter of the procedure.

目 錄
目錄……………………………………………………………….………………….IV
圖目錄………………………………………………………………………………..VI
表目錄………………………………………………………………………………VIII
第一章 緒論…………………………………………………………………………1
1.1 研究背景與動機…………………………………………………………...1
1.2 研究目的……………………………………………………………….......1
1.3 研究流程…….…………………………………………………………......2
1.4 論文架構…………………………………………………………………...3
第二章 文獻探討……………………………………………………………………4
2.1 半導體產業發展回顧……………………………………………………...5
2.2 半導體供應鏈探討………………………………………………………...8
2.2.1 半導體供應鏈體系…………………………………………………8
2.2.2 半導體供應鏈生產策略…………………………………………..11
2.3 半導體供應鏈現況探討………………………………………………….12
2.4 模式預測控制文獻回顧………………………………………………….14
第三章 研究方法…………………………………………………………………..18
3.1 半導體供應鏈..…………………………………………………………...20
3.2 半導體供應鏈生產預測模式…………………………………………….22
3.2.1 預測模式…………………………………..………………………23
3.2.2 目標函數………………………………………..…………………26
3.2.3 限制條件……………………………………………..……………27
第四章 半導體供應鏈生產系統模擬驗證………………………………………..30
4.1 問題描述………………………………………………………………….31
4.2 系統限制………………………………………………………………….32
4.3 需求型態………………………………………………………………….33
4.4 半導體供應鏈之模式預測控制應用分析………………………….……35
4.4.1 封裝/完成程序………………………….…………………………35
4.4.2 切割/測試程序…………………………………….………………37
4.4.3 製造/測試程序……………………………………………….……38
4.5 模式預測控制之模擬分析……………………………………………….39
4.5.1 製造/測試程序之MPC模擬分析…………………...……………39
4.5.2 切割/測試程序之MPC模擬分析……………………...…………41
4.5.3 封裝/完成程序之MPC模擬分析……………………………...…43
4.6 模式預測控制與半導體供應鏈之生產策略模擬……………………….45
4.6.1 牽引式／推擠式／推擠/牽引式 生產策略………………..…….46
4.6.2 系統實證…………………………………………….…………….47
4.6.3 穩定需求之製造/測試程序之生產策略模擬分析…………….…48
4.6.4 穩定需求之切割/測試程序之生產策略模擬分析…………….…50
4.6.5 穩定需求之封裝/完成程序之生產策略模擬分析…………….…53
4.6.6 非穩定需求之製造/測試程序之生產策略模擬分析…………….56
4.6.7 非穩定需求之切割/測試程序之生產策略模擬分析…………….58
4.6.8 非穩定需求之封裝/完成程序之生產策略模擬分析………….....61
第五章 結論與建議……………………………………………………….……….65
5.1 研究結論………………………………………...………………..………65
5.2 未來研究之建議………………………………………………………….66
參考文獻……………………………………………………………………………..67

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