臺灣博碩士論文加值系統

電解拋光技術是屬於一種精密拋光技術，拋光後可以去除材料表面的破壞層，得到平坦、光澤和無殘留應力的表面。而且又具有潔淨、高抗蝕性、無拋光應力、不產生毛邊等優點，廣泛的運用於半導體製程設備、生醫、精密機械製造等領域。
黏稠層被破壞是造成製程不穩定的主因，影響黏稠層的原因主要有電化學作用、流體擾動和氣泡。尤其，反應過程中所產生的氣泡，造成溶液被過度擾動，嚴重破壞擴散層的穩定性。所以，在製程穩定性不佳的情況下，製程精度不好掌控，並容易產生流痕、孔蝕等缺陷於工件表面上，降低表面品質。
為了改善製程的穩定性，本研究針對目前使用的電解液進行改良，透過實驗設計法的協助，找出減少氣泡生成，增加穩定性的添加劑，與最佳添加量。透過長效時間實驗，以表面粗糙度和電解液金屬濃度為指標，推測出電解液的壽命，達到提高對電解液性能與穩定度的目標。
本研究建立電解拋光物理模型，討論電荷分布與擴散作用對電解拋光製程的影響。採用商用軟體，FEMLAB，建立3維的物理模型，模擬在不同陰極電極面積、陰極形狀和間隙下，表面電荷濃度分布的情況。再以表面輪廓儀，量測去除量的分布，探討去除量和電荷濃度分布的關係，釐清參數真正影響的關係。並找出改善加工精度的參數範圍，提高參數控制與治具設計的能力。針對物理模型所找出的參數範圍，進行實驗，以表面機械性質與表面化學電化學性質為評估指標，評斷表面品質改善的效果，藉由實驗的方式，找出最佳參數，以獲得高精度與品質的拋光效果。
透過本研究所建立之物理模型，與對參數作用的了解，可以快速評斷陰極設計的效果，加快陰極設計的流程，並找出加工精度較高的參數設定區間，再對此區間進行實驗，以得最佳的參數，相較於先前的方法，在陰極設計與找尋最佳參數上，顯得更有效果與效率。
本研究亦建立一套完整的表面評估程序，透過高敏感度的表面缺陷影像辨識系統，與粗糙度量測，成為一有效、快速且辨識度高的表面機械性質評估指標，可以輕易辨識不同參數所造成的影響。再配合快速、大範圍且低廉的腐蝕評估，評估鈍化層的性能，對於參數改善與拋光效果的提升，有很大的助益。
透過上述的研究，將可提供一快速導入新應用的方法，快速完成陰極設計並取得最佳參數，減少嘗試錯誤所需的時間，達到提升製程穩定度和均勻性的目標。

The electropolishing(EP) is a surface finishing treatment technique. The surface quality indices such as surface roughness, cleanness and corrosion resistance could be improved through this process. Therefore, the electropolishing process was widely used to fabricate high cleanness apparatus for semiconductor optical and pharmaceutical industries.
The electropolishing is an electrochemical process. The uniform and stable viscous layer was the key mechanism in enhancing the surface quality. The forming of viscous layer was influenced by the current distribution, gas bubble, fluid field and diffusion phenomena. Therefore, undesirable topology such as pitting, flow marks and scrape could be found after the electropolishing process which also reduces geometrical precision.
This study is foci on numerical simulation and experimental measurement of the EP process. A numerical simulation model is established with process variables of operating potential, electrode area ratio, electrode geometry and electrode gap to simulate the iron concentration distribution on the surface of specimen. Based on the simulated results, proper process variables were chosen to conduct the EP experiments. From the experiments, profiles of the original and processed specimen were then measured by surface profile scanning machine to verify the simulation results. It could establish a relationship between iron concentration and metal removal. The results showed that the simulated iron concentration distribution data did emulate the topological contour.
In this study, the surface topological and chemical properties were also studied. The indices such as surface roughness and defects were employed to evaluate the surface topological properties. The corrosion resistance such as uniform corrosion, intergranular corrosion, pitting corrosion and XPS/AES were employed to evaluate the passive film properties. The optical surface defects analysis exhibits good capabilities of high sensitivity, wider range of measurement and high efficiency to identify the surface quality under different process variables. It also provides the evidence to confirm the improvement of surface quality and stability of the EP process.
In summary, a new methodology has been developed which could greatly improve the stability and uniformity of the EP process. It also provides an efficient way for electrode design, optimize process parameters and save the time of try-and-error.

摘要 1
Abstracts 3
1. 緒論 5
1.1 研究背景與目的 5
1.2 研究目標 6
1.3 論文架構 7
2. 文獻回顧 9
2.1電解拋光(EP)原理 10
2.2影響製程的物理現象 12
2.3拋光參數 14
3. 研究架構與方法 17
3.1電解拋光製程加工精度提升研究 18
3.1.1物理模型建立 19
3.1.2去除量分布量測系統建立 21
3.1.3去除特徵驗驗證實驗 23
3.2 表面品質改善研究 24
4. 電解拋光製程加工精度提升研究 27
4.1問題描述 27
4.2電荷分布模型建立 29
4.3 實驗結果與討論 31
4.3.1電荷分布(長方形陰極，陰陽極面積比1:1) 32
4.3.2電荷分布(圓陰極，陰陽極面積比1:1) 34
4.3.3電荷分布(長方形陰極，陰陽極面積比1.5:1) 36
4.3.4電荷分布(圓形陰極，陰陽極面積比1.5:1) 38
4.3.5電荷分布(長方形陰極，陰陽極面積比2:1) 40
4.3.6電荷分布(圓形陰極，陰陽極面積比2:1) 42
4.3.7小結 44
4.4陽極電荷分布方程式 45
4.5擴散模型建立 47
4.5.1濃度分布 (間隙3mm，長方形陰極，面積比1) 48
4.5.2濃度分布 (長方形陰極，面積比1.5) 49
4.5.3濃度分布 (長方形陰極，面積比2) 50
4.5.4濃度分布 (圓形陰極，面積比1) 52
4.5.5濃度分布 (圓形陰極，面積比1.5) 53
4.5.6濃度分布 (圓形陰極，面積比2) 54
4.6表面去除量分布量測實驗 56
4.7去除量分布方程式建立 62
4.7.1 間隙3mm的去除量分布方程式 62
4.7.2 間隙5mm的去除量分布方程式 63
4.8 驗證實驗 65
5. 電解拋光表面品質改善研究 68
5.1問題描述 68
5.2電解液改善研究 68
5.2.1降低氣泡影響研究 69
5.2.2壽命評估 74
5.3表面機械性質改善研究 76
5.3.1表面缺陷評估研究 82
5.4 表面化學電化學性質改質研究 86
5.4.1 均勻腐蝕(Uniform corrosion)測試研究 86
5.4.2 晶界腐蝕腐(Intergranular corrosion, IGC)蝕測試實驗 88
5.4.3 孔蝕測試(Pitting corrosion)實驗 90
5.5 鈍化膜成份分析 95
6. 結論與未來展望 100
6.1 結論 100
6.2 未來展望 100

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